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Shenzhen Jingcheng Yu Electronics Technology Co., Ltd

Showing 1 - 6 of 6, total 1 pages        [First] [Previous] [Next] [Last]

1
hdi board
hdi board
Specification: 10 Layer,HDI
Detail: 10 Layer,HDI Application: GPS,Moble telephone,consumable,etc

2
buried circuit board
buried circuit board
Specification: 6-12 Layer,Blined/Buried Via
Detail: 6-12 Layer,Blined/Buried Via Application: Secondary Power Supply,etc

3
ptfe board
ptfe board
Specification: PTFE Board
Detail: PTFE Board Application: Microwave RF,etc

4
rigid-flexible board
rigid-flexible board
Specification: Rigid-Flexible Board
Detail: Application: Medical equipment,Consumer Electronic,Aviation,etc

5
printed circuit board
printed circuit board
Specification: 16 Layer,Blind&Buried Via
Detail: 16 Layer,Blind&Buried Via Application: Secondary Power Supply,Applied Electronic,etc

6
double board
double board
Specification: 12 Layer,5OZ Copper,Thickness 5mm
Detail: 12 Layer,5OZ Copper,Thickness 5mm Application: Secondary power Supply,etc
Showing 1 - 6 of 6, total 1 pages        [First] [Previous] [Next] [Last]
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